【摘要】：為迎合現(xiàn)代社會對電子產(chǎn)品的集成化、便攜化要求,PCB板正在向著高密度、多層化、輕薄化發(fā)展,PCB板上的微孔加工,是電子元器件實(shí)現(xiàn)電氣互聯(lián)的必要工序。本文一方面針對PCB板自身結(jié)構(gòu)及其材料配比在超高轉(zhuǎn)速的條件下對PCB板機(jī)械鉆削性能的影響進(jìn)行了一系列實(shí)驗(yàn)研究,將PCB板中各材料的質(zhì)量比重定義為四個(gè)等級,并以5種典型PCB板中各材料的質(zhì)量等級為參考,基于實(shí)驗(yàn)結(jié)果,采用對比分析的方法提出了分別以鉆削溫度、軸向力、微孔質(zhì)量為指向的PCB優(yōu)化方案。另一方面將PCB微孔鉆削簡化為對銅箔和多層玻璃纖維復(fù)合材料(GFRP)的鉆削,在ABAQUS中成功建立了銅箔及多層GFRP有限元模型,并在超高轉(zhuǎn)速條件下對兩者進(jìn)行了鉆削模擬,且仿真有效。在實(shí)驗(yàn)研究方面,先后進(jìn)行了鉆削溫度、軸向力以及孔質(zhì)量的探究,以對比分析方法分析了PCB板材結(jié)構(gòu)及各材料含量對鉆削溫度、鉆削力、孔質(zhì)量的影響,并歸納出以溫度、鉆削力、孔質(zhì)量為指向的PCB結(jié)構(gòu)及材料優(yōu)化方案:以更優(yōu)軸向力特性為目標(biāo)的PCB鉆孔,宜選用填料含量在16%-30%且樹脂含量在31%-50%的雙面PCB板;以取得更低鉆削溫度或更優(yōu)孔質(zhì)量為目標(biāo)的PCB鉆孔,應(yīng)選用填料含量在31%-50%和樹脂含量在16%-30%的多層PCB板,填料尺寸小且分布均勻時(shí)其效果更佳。在仿真研究方面,建立了基于Hasin損傷準(zhǔn)則的多層GFRP有限元模型,和基于Johnson-cook剪切準(zhǔn)則的銅箔有限元模型,并分別對兩者進(jìn)行鉆削模擬。銅箔鉆削仿真結(jié)果顯示,在超高速鉆削條件下,鉆頭兩主切削刃溫度分布明顯不均,且主軸轉(zhuǎn)速越高,這一現(xiàn)象越明顯,溫差隨鉆削深度加大而加劇。GFRP鉆削仿真結(jié)果顯示,鉆削多層GFRP的應(yīng)力可看作分別鉆削單層復(fù)合材料的應(yīng)力疊加,且疊加層數(shù)越多,層與層之間相互干涉程度越大;基體總是先于纖維破壞,且損傷程度高于纖維;纖維主要受到拉伸作用;多層GFRP孔較銅箔孔有明顯的撕裂、起毛、分層現(xiàn)象,且隨主軸轉(zhuǎn)速降低而加劇。
[Abstract]:In order to meet the integration of electronic products in modern society, portable PCB board is developing towards high density, multilayer and thinning, which is the necessary procedure for electronic components to realize electrical interconnection. On the one hand, a series of experiments have been carried out to study the influence of the structure of PCB plate and its material ratio on the mechanical drilling performance of PCB plate under the condition of ultra-high speed. The weight specific gravity of each material in PCB plate is defined as four grades. Based on the experimental results, a PCB optimization scheme with drilling temperature, axial force and micropore mass as the direction is proposed based on the experimental results and the reference of each material quality grade in five typical PCB boards. On the other hand, PCB microhole drilling is simplified as drilling copper foil and multilayer glass fiber composite (GFRP). The finite element model of copper foil and multilayer GFRP is successfully established in ABAQUS. And the simulation is effective. In the aspect of experimental research, drilling temperature, axial force and hole quality have been studied successively. The effects of structure and material content of PCB sheet on drilling temperature, drilling force and hole quality have been analyzed by comparative analysis, and the temperature has been summarized. Drilling force and pore quality oriented PCB structure and material optimization scheme: for PCB drilling with better axial force characteristics, the double-sided PCB plate with packing content of 16-30% and resin content of 31- 50% should be selected. In order to obtain lower drilling temperature or better hole quality, multilayer PCB plates with packing content of 31% -50% and resin content of 16% -30% should be selected for PCB drilling. The effect is better when the packing size is small and the distribution is uniform. In the aspect of simulation, multi-layer GFRP finite element model based on Hasin damage criterion and copper foil finite element model based on Johnson-cook shearing criterion are established. The simulation results of copper foil drilling show that the temperature distribution of the two main cutting edges of the bit is obviously uneven under ultra-high speed drilling conditions, and the higher the spindle speed is, the more obvious this phenomenon is, and the temperature difference increases with the drilling depth. The simulation results show that the temperature difference increases with the drilling depth. The stress of multi-layer GFRP can be regarded as the superposition of the stress of single layer composites, and the more the number of stacked layers, the greater the degree of interference between layers, the matrix is always destroyed before fiber, and the degree of damage is higher than that of fiber. The fiber is mainly subjected to tensile action, and the multilayer GFRP pore has obvious tearing, piling and delamination phenomenon compared with the copper foil hole, and it is aggravated with the decrease of the spindle speed.
【學(xué)位授予單位】：深圳大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2017
【分類號】：TN41;TG52

【參考文獻(xiàn)】

相關(guān)期刊論文 前10條

1 ;全球2015年P(guān)CB市場下降3.7%產(chǎn)值達(dá)553億美元[J];覆銅板資訊;2016年02期

2 楊宏強(qiáng);;全球PCB產(chǎn)業(yè)現(xiàn)狀分析及策略研究(2015)[J];印制電路信息;2016年01期

3 金曉波;康萬軍;曹軍;徐穎翔;;碳纖維復(fù)合材料/鈦合金疊層板鉆孔有限元仿真研究[J];工具技術(shù);2015年01期

4 付連宇;郭強(qiáng);;印制板用微型鉆頭及微孔鉆削進(jìn)展[J];印制電路信息;2014年05期

5 鮑永杰;高航;梁延德;朱國平;;碳纖維/環(huán)氧樹脂復(fù)合材料鉆削溫度場建模與試驗(yàn)[J];兵工學(xué)報(bào);2013年07期

6 黃立新;鐘峻青;;基于熱-力多物理場耦合理論的鉆削仿真研究[J];機(jī)械設(shè)計(jì)與制造;2013年03期

7 孫曉軍;;鉆削印刷電路板的試驗(yàn)研究[J];工程與試驗(yàn);2012年04期

8 馮勇;汪木蘭;王保升;;高速切削熱及溫度預(yù)測研究進(jìn)展[J];機(jī)械設(shè)計(jì)與制造;2012年05期

9 童慧芬;王偉;劉偉;;基于Deform 3D的深孔鉆削溫度場仿真研究[J];機(jī)電技術(shù);2011年05期

10 湯宏群;王成勇;王冰;;電路板復(fù)合材料高速鉆削刀具的磨損[J];熱加工工藝;2010年10期

，

本文編號：2231574