三維封裝銅柱應(yīng)力及結(jié)構(gòu)優(yōu)化分析
發(fā)布時(shí)間：2019-05-15 02:38
【摘要】：文中利用有限元模擬軟件ANSYS對(duì)三維立體封裝芯片發(fā)熱過(guò)程中整體應(yīng)力及局部銅柱的應(yīng)力情況進(jìn)行了分析,并對(duì)三維封裝的結(jié)構(gòu)進(jìn)行了優(yōu)化設(shè)計(jì).結(jié)果表明,最大應(yīng)力分布在銅柱層,銅柱的應(yīng)力最大點(diǎn)出現(xiàn)在銅柱外側(cè)拐角與底部接觸位置.以銅柱處最大應(yīng)力作為響應(yīng),進(jìn)行了結(jié)構(gòu)參數(shù)優(yōu)化,采用三因素三水平正交試驗(yàn)方法,分別使用銅柱直徑、銅柱高度、銅柱間距三個(gè)影響因素作為變化的結(jié)構(gòu)參數(shù).結(jié)果表明,銅柱直徑的變化對(duì)等效應(yīng)力影響最大,銅柱間距次之,銅柱高度影響最小.且發(fā)現(xiàn)隨著銅柱高度、銅柱間距、銅柱直徑的不斷增大其銅柱外側(cè)拐角與底部接觸位置的最大等效應(yīng)力不斷減小.
[Abstract]:In this paper, the finite element simulation software ANSYS is used to analyze the overall stress and the stress of local copper column in the heating process of 3D packaging chip, and the structure of 3D package is optimized. The results show that the maximum stress is distributed in the copper column layer, and the maximum stress point of the copper column appears at the contact position between the outside corner and the bottom of the copper column. In response to the maximum stress at the copper column, the structural parameters were optimized. Three factors affecting the diameter of the copper column, the height of the copper column and the spacing of the copper column were used as the structural parameters by using the orthogonal test method of three factors and three levels. The results show that the variation of copper column diameter has the greatest effect on equivalent stress, followed by copper column spacing and copper column height. It is found that the maximum equivalent stress between the outer corner and the bottom of the copper column decreases with the increase of the height of the copper column, the distance between the copper columns and the diameter of the copper column.
【作者單位】： 哈爾濱理工大學(xué)材料科學(xué)與工程學(xué)院;
【基金】：黑龍江省自然科學(xué)基金資助項(xiàng)目(E201449)
【分類號(hào)】：TN405
本文編號(hào)：2477250
[Abstract]:In this paper, the finite element simulation software ANSYS is used to analyze the overall stress and the stress of local copper column in the heating process of 3D packaging chip, and the structure of 3D package is optimized. The results show that the maximum stress is distributed in the copper column layer, and the maximum stress point of the copper column appears at the contact position between the outside corner and the bottom of the copper column. In response to the maximum stress at the copper column, the structural parameters were optimized. Three factors affecting the diameter of the copper column, the height of the copper column and the spacing of the copper column were used as the structural parameters by using the orthogonal test method of three factors and three levels. The results show that the variation of copper column diameter has the greatest effect on equivalent stress, followed by copper column spacing and copper column height. It is found that the maximum equivalent stress between the outer corner and the bottom of the copper column decreases with the increase of the height of the copper column, the distance between the copper columns and the diameter of the copper column.
【作者單位】： 哈爾濱理工大學(xué)材料科學(xué)與工程學(xué)院;
【基金】：黑龍江省自然科學(xué)基金資助項(xiàng)目(E201449)
【分類號(hào)】：TN405
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