【摘要】：伴隨著微電子技術(shù)的快速發(fā)展，集成電路芯片逐漸向深亞微米方向發(fā)展，電子元器件的微型化和高功能化使得封裝變得要求更高，這些都給SMT領(lǐng)域帶來了不小的挑戰(zhàn)。SMT的核心設(shè)備是貼片機，也正朝著多功能、高速度、高精度方向發(fā)展，貼片機是一個集機械、光學(xué)、電學(xué)等多學(xué)科于一體的產(chǎn)品，主要由機械系統(tǒng)、視覺系統(tǒng)和控制系統(tǒng)組成，本課題主要研究貼片機的機械系統(tǒng)，包括框架結(jié)構(gòu)和運動系統(tǒng)。對于貼片機而言，貼裝速度和精度的高要求使得機械結(jié)構(gòu)的性能變得至關(guān)重要。 本論文利用ADAMS軟件為工具建立虛擬樣機模型，通過理想模型和原模型的仿真結(jié)果對比來分析各個因素對貼裝頭的動態(tài)精度影響，并根據(jù)結(jié)論找到提高貼裝頭定位精度的方法。 利用有限元分析軟件對重要構(gòu)件進行靜力學(xué)分析，，通過計算和得出的應(yīng)力云圖、位移云圖找出構(gòu)架中應(yīng)力集中和易變形的位置，然后通過改良設(shè)計來提高機械系統(tǒng)的靜剛度。 利用有限元分析軟件對主要構(gòu)件以及整機簡化系統(tǒng)進行模態(tài)分析，對比固有頻率和振型圖，對其進行結(jié)構(gòu)改進使其固有頻率遠離驅(qū)動頻率來避免共振的出現(xiàn)，同時對跨度大，易變形的構(gòu)件進行剛度提高改進，具體措施本文也提到了一些，來實現(xiàn)貼片機整機的動態(tài)特性優(yōu)化。 本論文的研究對象是自主研發(fā)的一臺高檔貼片機，通過動態(tài)分析和結(jié)構(gòu)優(yōu)化，樣機的精度和速度已經(jīng)基本達到10000片/小時的速度和20um-50um的精度設(shè)計目標。
[Abstract]:With the rapid development of microelectronics technology, integrated circuit chips are gradually developing in the direction of deep submicron. The miniaturization and high functionalization of electronic components make packaging more demanding. These bring a lot of challenges to the field of SMT. SMT's core equipment is placement machine, which is also developing in the direction of multi-function, high speed and high precision. SMT is a multi-disciplinary product, such as machinery, optics, electricity and so on. It is mainly composed of mechanical system, visual system and control system. This paper mainly studies the mechanical system of placement machine, including frame structure and motion system. For the placement machine, the high requirements of mounting speed and accuracy make the performance of the mechanical structure become very important. In this paper, the virtual prototype model is established by using ADAMS software as a tool, and the influence of each factor on the dynamic accuracy of the mounting head is analyzed by comparing the simulation results of the ideal model with the original model, and the method to improve the positioning accuracy of the mounting head is found according to the conclusion. The static analysis of important components is carried out by using finite element analysis software. The position of stress concentration and easy deformation in the frame is found out by calculating and obtaining stress cloud diagram and displacement cloud diagram, and then the static stiffness of mechanical system is improved by improved design. The modal analysis of the main components and the simplified system of the whole machine is carried out by using the finite element analysis software. The natural frequency and vibration mode diagram are compared, and the structure is improved so that the natural frequency is far away from the driving frequency to avoid the occurrence of resonance, and at the same time, the span is long. The stiffness of the easily deformed members is improved, and some concrete measures are also mentioned in this paper to optimize the dynamic characteristics of the patch machine. The research object of this paper is a high-grade placement machine developed by ourselves. through dynamic analysis and structure optimization, the accuracy and speed of the prototype have basically reached the speed of 10000 chips per hour and the precision design goal of 20um-50um.
【學(xué)位授予單位】：吉林大學(xué)
【學(xué)位級別】：碩士
【學(xué)位授予年份】：2015
【分類號】：TN405

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相關(guān)期刊論文 前1條

1 王成,王效岳;虛擬樣機技術(shù)及ADAMS[J];機械工程與自動化;2004年06期

本文編號：2481397