本文選題：玻璃空心微珠 + 無(wú)極保溫材料　； 參考：《大連交通大學(xué)》2015年碩士論文

【摘要】：泡沫玻璃保溫板相較于市場(chǎng)上廣為流行的有機(jī)保溫板來(lái)說(shuō),有著不燃、吸水率低等優(yōu)點(diǎn),但傳統(tǒng)泡沫玻璃保溫板制備工藝有著燒結(jié)溫度高、氣孔孔徑不可控等缺點(diǎn)。本文采用玻璃空心微珠堆燒的方法制備泡沫玻璃保溫材料,研究了玻璃空心微珠在形成保溫板過(guò)程中的變化過(guò)程及不同燒結(jié)制度對(duì)玻璃空心微珠保溫材料性能的影響,試圖尋找燒結(jié)玻璃空心微珠保溫材料的最佳燒結(jié)制度,并利用DTA、SEM、XRD、導(dǎo)熱系數(shù)儀等檢測(cè)手段對(duì)燒制好的玻璃空心微珠保溫材料進(jìn)行性能表征。其結(jié)果如下:玻璃空心微珠在達(dá)到軟化溫度時(shí)開(kāi)始通過(guò)連接頸進(jìn)行連結(jié),隨著燒結(jié)溫度的提高,連接頸逐漸增大,直至分不出玻璃空心微珠之間的界限,在660℃燒結(jié)時(shí)形成一整塊帶有均勻氣孔的玻璃空心微珠保溫材料;之后燒結(jié)溫度的提升造成氣孔的合并、長(zhǎng)大其容重逐漸降低。660℃至780℃之間的燒結(jié)溫度燒結(jié),樣品的容重隨著燒結(jié)溫度的提升而降低,超過(guò)780℃燒結(jié)時(shí),由于熔融態(tài)玻璃的粘度過(guò)低,造成玻璃空心微珠保溫材料內(nèi)的氣體溢出加劇,容重有升高趨勢(shì);在700℃時(shí)開(kāi)始出現(xiàn)析晶現(xiàn)象,隨著燒結(jié)溫度的提升,析晶現(xiàn)象加劇,同時(shí)析晶現(xiàn)象會(huì)造成物質(zhì)的偏聚,對(duì)于孔壁較薄的樣品來(lái)說(shuō),會(huì)顯著提升樣品的開(kāi)孔率。在700℃燒結(jié)時(shí),保溫時(shí)間的延長(zhǎng)會(huì)使氣相物質(zhì)在熔融態(tài)玻璃中充分的長(zhǎng)大,降低樣品的容重,在780℃時(shí)則對(duì)容重影響不大;但是長(zhǎng)時(shí)間處于高溫狀態(tài)會(huì)造成玻璃成核量加大,導(dǎo)致樣品中析晶的加劇;較低的容重意味著玻璃空心保溫材料內(nèi)氣孔較多,或者氣孔較大,可以顯著降低玻璃空心微珠的導(dǎo)熱系數(shù);而開(kāi)孔率的增加會(huì)使內(nèi)部的氣體流通加劇,造成導(dǎo)熱系數(shù)的提升。提高燒結(jié)時(shí)的升溫速率可以加大玻璃空心微珠保溫材料內(nèi)氣相物質(zhì)與熔融態(tài)玻璃的溫差增大,氣相物質(zhì)的熱脹冷縮的幅度也更大,可以降低玻璃空心微珠保溫材料的容重,但降低幅度有限;同時(shí)由于并未給予玻璃充分的成核時(shí)間,并相對(duì)降低了玻璃達(dá)到成核溫度的時(shí)間,對(duì)析晶量的影響較小。經(jīng)實(shí)驗(yàn)確定,在燒結(jié)溫度為780℃,升溫速率為3℃/min,保溫時(shí)間為0.5h的樣品具有最佳的綜合性能,其容重為0.131g/cm3,體積吸水率為6.955%,抗壓強(qiáng)度為1.275MPa,同時(shí)測(cè)得該樣品在25℃(實(shí)測(cè)23.06℃)的導(dǎo)熱系數(shù)為0.602W/(m?K)。
[Abstract]:Compared with the organic thermal insulation board which is widely used in the market, the foamed glass insulation board has the advantages of noncombustible and low water absorption. However, the traditional preparation process of the foam glass insulation board has the disadvantages of high sintering temperature and uncontrollable pore diameter. In this paper, foam glass insulation materials were prepared by the method of glass hollow bead piling. The change process of glass hollow microbeads in the process of forming insulation board and the influence of different sintering systems on the properties of glass hollow microspheres were studied. This paper attempts to find out the best sintering system of the sintered glass hollow microbeads and to characterize the properties of the sintered glass hollow microbeads by means of DTAA SEM XRD and thermal conductivity meter. The results are as follows: when the glass hollow beads reach the softening temperature, they begin to connect through the connecting neck. With the increase of sintering temperature, the connecting neck increases gradually, until the boundary between the glass hollow beads can not be distinguished. When sintered at 660 鈩，

本文編號(hào)：1853888